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Factoryin progressAugust 27, 2026

SK hynix breaks ground on $4B U.S. HBM packaging fab

SK hynixINWest Lafayette

SK hynix broke ground on its first U.S. high-bandwidth-memory production hub in West Lafayette. The advanced packaging fab and R&D testbed are expected to support about 1,000 operating jobs, anchor more than 100 supply-chain partners, and begin mass production in the second half of 2029.

#semiconductors#hbm#advanced-packaging#ai#indiana

Sources

  1. SK hynix newsroomnews.skhynix.com · 2026-08-28
  2. Indiana Economic Development Corporationiedc.in.gov · 2026-08-27

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